发明名称 DEVICE AND METHOD FOR PLASMA TREATMENT
摘要 PROBLEM TO BE SOLVED: To suppress an increase in manufacturing cost caused by the exhaustion of a peripheral member of an electrode in conducting plasma treatment. SOLUTION: A plasma treatment device is provided with the electrode which is disposed in a reaction chamber and has an arrangement that enables the electrode to mount a substrate 12, and the peripheral member 15 fixed around the electrode. The device carries out the treatment of the substrate 12 by generating plasma from the electrode. A notch 1 formed in the substrate 12 or a portion 2, which is adjacent thereto in orientation flat, of the peripheral member 15 is separably arranged. Accordingly, when the notch 1 is exhausted by plasma, or the peripheral member 15 is exhausted from the orientation flat position by plasma, only the separable portion 2, in the corresponding position, of the peripheral member 15 has to be replaced, which eliminates the necessity for changing the whole peripheral member 15. Thus the manufacturing cost is reduced. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003197604(A) 申请公布日期 2003.07.11
申请号 JP20010390848 申请日期 2001.12.25
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 SAKAMOTO MASANORI;MATSUMOTO SEIJI;HISAKURE SHIYUNSUKE
分类号 H01L21/302;H01L21/3065;(IPC1-7):H01L21/306 主分类号 H01L21/302
代理机构 代理人
主权项
地址