| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an apparatus for supplying a liquid for polishing which is capable of supplying a liquid for polishing with a stable quality to a polishing apparatus. <P>SOLUTION: The apparatus for supplying a liquid for polishing containing a material for CMP slurry to a polishing apparatus is provided with piping loops 20, 22, 24, and 16 for circulating the liquid for polishing in a supply line 2 for supplying the liquid for polishing to the polishing apparatus. The piping loops 20 and 22 can be started and finished at a storage means 4 for the liquid for polishing, while the piping loops 24 and 26 can be started and finished at a mixing means 12 for the liquid for polishing. <P>COPYRIGHT: (C)2003,JPO |
