| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing pad which is hardly be clogged and has a small variation in polishing performance in polishing processes, particularly in a CMP process. <P>SOLUTION: Using globular thermoplastic urethane resin grains having an average grain diameter of 30 μm as plastic grains, a disc-like polishing pad having a diameter of 600 mmϕ and a thickness of 2.5 mm is formed. After dressing the surface of the polishing pad with ion exchanged water being dropped by means of a diamond disc, a Cu film is polished with a polishing slurry being dropped. <P>COPYRIGHT: (C)2003,JPO |
