| 摘要 |
<P>PROBLEM TO BE SOLVED: To make a semiconductor device in a stuck structure high in reliability and fast. <P>SOLUTION: The semiconductor device includes a die pad 30, a plurality of semiconductor chips which are stacked on one surface of the die pad 30, leads 34 which extend toward the die pad 30, 1st wires 40 connected to 1st pads 12 of 1st semiconductor chips 10 and 2nd pads 22 of 2nd semiconductor chips among the plurality of semiconductor chips, 2nd wires 50 connected to the leads and 1st or 2nd pads 12 and 22, and sealing material 60 which seals the plurality of semiconductor chips while the other surface of the die pad 30 is exposed. <P>COPYRIGHT: (C)2003,JPO |
