| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method for a semiconductor device and a wiring board preferably used therefor wherein there can be prevented resin leakage, the production of resin burrs and bleeding of a solvent, etc. <P>SOLUTION: A wiring board 20 is adapted characterized in that: a number of lines of semiconductor chip mounting sections are provided on one surface of a band shaped resin board 21 longitudinally of the resin board 21 in each of which semiconductor chip mounting sections a plurality of semiconductor chip mounting sections 22 are arranged in the width direction of the resin board 21; a number of lines of through-holes are provided in the longitudinal direction of the resin board 21 for each of which through-holes a through-hole 23 having a size covered by mounted semiconductor chips is formed in each semiconductor chip mounting section on the semiconductor chip mounting section lines; there are provided on the other surface of the resin board 12 a terminal section of the semiconductor chip mounted on the semiconductor chip mounting section 22 and a wiring pattern 24 connected electrically through a bonding wire passing through the through-hole 23; and in the wiring board, a resin communication hole 25 is provided in the surface and back surface of the resin board 21 only in one side edge of the resin board 21 located on an extension line of the through-hole line corresponding to each semiconductor chip mounting section line. <P>COPYRIGHT: (C)2003,JPO |
