SEMICONDUCTOR INTEGRATED CIRCUIT, MANUFACTURING METHOD FOR THE SEMICONDUCTOR INTEGRATED CIRCUIT, SEMICONDUCTOR ELEMENT MEMBER, ELECTROOPTIC DEVICE, AND ELECTRONIC EQUIPMENT

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor integrated circuit which improves the use rate of a semiconductor substrate where a semiconductor element is formed and decreases waste of manufacturing processes for the integrated circuit, a manufacturing circuit for the semiconductor integrated circuit, a semiconductor element member, an electrooptic device, and electronic equipment.

SOLUTION: On the substrate 10 of a semiconductor, a semiconductor device (semiconductor element) 13 is formed and only a function layer 12 which is a surface layer on the substrate 10 and includes the semiconductor device (semiconductor element) 13 is cut into fine tiles apart from the substrate 10.

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