| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition having excellent insulation reliability as a material for an additive method printed circuit board. SOLUTION: The resin composition contains (a) a multifunctional epoxy resin, (b) a curing agent, (c) a curing accelerator, (d) a flexible material, and (e) an inorganic ion-exchange material. COPYRIGHT: (C)2003,JPO |
