发明名称 THERMOELECTRIC MODULE
摘要 PROBLEM TO BE SOLVED: To provide a thermoelectric module that is highly reliable and has high performance by optimizing plating and joint condition. SOLUTION: The surface roughness Ra of a thermoelectric element on a plane joined with a supporting substrate is set at 0.5-2.0μm and that thereof excluding the joint surface is 0.5μm or less. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003197981(A) 申请公布日期 2003.07.11
申请号 JP20010393209 申请日期 2001.12.26
申请人 KYOCERA CORP 发明人 NAGASAKI KOICHI
分类号 H01L35/08;H01L35/16;H01L35/18;H01L35/32;H01L35/34;(IPC1-7):H01L35/08 主分类号 H01L35/08
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