发明名称 APPARATUS AND METHOD FOR IMPLANTING FILM CARRIER TAPE FOR MOUNTING ELECTRONIC ELEMENT, AND METHOD FOR MANUFACTURING THE FILM CARRIER TAPE
摘要 PROBLEM TO BE SOLVED: To perform an implanting method by which defective calking never occurs in spite of performing mass implant, an implanting metallic material is prevented from coming off from an implanting hole and conductivity with a base film is secured by speedily, precisely and reliably calking the implanting metallic material to the surrounding of the implanting hole. SOLUTION: The implanting apparatus of a film carrier tape for mounting an electronic element is provided with an implanting die. The implanting die is provided with an implanting hole boring part where implanting hole boring pins for boring by punching are arranged, and an implanting part where implanting pins for burying the implanting metallic material into the implanting holes by punching are arranged. The implanting metallic material is supplied crossing the carrying direction of the film carrier tape. The apparatus is also provided with a calking die for calking upper and lower surfaces of the buried implanting material. As for the surface of the calking die, a place corresponding to an implanting position is hardened partially by hardening processing. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003197695(A) 申请公布日期 2003.07.11
申请号 JP20010400584 申请日期 2001.12.28
申请人 SUZUKI CO LTD;MITSUI MINING & SMELTING CO LTD 发明人 NAKAMURA TOSHIYUKI;KARASAWA FUMIAKI;ICHIYANAGI AKIRA;HAYASHI KATSUHIKO
分类号 B23H9/00;H01L21/60;H05K3/40;(IPC1-7):H01L21/60 主分类号 B23H9/00
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