| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device capable of shortening a conductive circuit from an electrode terminal for a mounted semiconductor element to a capacitor as mush as possible. <P>SOLUTION: In the semiconductor device 10, in which the semiconductor element 12 is mounted on the package 15 for the semiconductor device provided with the capacitor 18 arranged in a circuit base board 14, the capacitor 18 is arranged immediately below the semiconductor element mounting surface of the circuit base board 14 on which the semiconductor element 12 is mounted and, in order to obtain the shortest distance of the conductive circuit electrically connecting the semiconductor element 12 to the capacitor 18, the external connecting terminal 18a of the capacitor 18 is directly connected to the semiconductor element mounting surface of the circuit base board 14 on the other surface side of a connecting pad 32c, whose one surface side directly connected to the electrode terminal 12a of the semiconductor element is exposed. <P>COPYRIGHT: (C)2003,JPO |
