| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a low-price, small-size, and high-performance semiconductor integrated circuit mounting body. <P>SOLUTION: The semiconductor integrated circuit mounting body comprises a semiconductor substrate 1; a first metal pattern 72a which is allocated on the first main surface of the semiconductor substrate 1 and includes, at a part thereof, stepped electrodes 51a, 51b different in thicknesses from other flat areas; a second metal pattern 74a which is allocated on the first main surface of the semiconductor substrate 1, has the same thickness of the flat area as that of the first metal pattern 72a, and includes, at a part thereof, second stepped electrodes 51d, 51e of the same sizes and shapes as the first stepped electrodes 51a, 51b; an assembly substrate 2; and bump lands 5a, 5b, 5d and 5e on the surface of the assembly substrate 2, and bumps 3a, 3b, 3d and 3e connecting the stepped electrodes 51a, 51b, 51d and 51e and the bump lands 5a, 5b, 5d and 5e. <P>COPYRIGHT: (C)2003,JPO |
