发明名称 MICROWAVE INTEGRATED CIRCUIT
摘要 <P>PROBLEM TO BE SOLVED: To provide a microwave integrated circuit using an interdigital capacitor having a coplanar structure, which reduces the crosstalk with external circuits, decreases the influence on the microwave integrated circuit and external circuits, and increases the charge capacity value of an interdigital capacitor. <P>SOLUTION: The interdigital capacitor 11 has a coplanar structure used for a microwave integrated circuit 10. A bridge-like ground conductor 14 is bridged above and across coplanar electrodes 12, 13 to reduce the crosstalk and the influence on the microwave integrated circuit 10 and external circuits and to increase the charge capacity value of the capacitor 11. <P>COPYRIGHT: (C)2003,JPO
申请公布号 JP2003197758(A) 申请公布日期 2003.07.11
申请号 JP20010397488 申请日期 2001.12.27
申请人 TOSHIBA CORP 发明人 TAKASU HIDEKI
分类号 H01L27/04;H01L21/822;H01P3/02 主分类号 H01L27/04
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