| 发明名称 |
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE |
| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of manufacturing semiconductor device including a flip-chip connection method assuring excellent productivity and reliability or the like. <P>SOLUTION: A plurality of chips 2 are disposed on an interposer 3 in a face-down way, and these chips are bonded by the flip-chip bonding method. A gap of the external surface side of each chip 2 and the lower surface side of the chip 2 is sealed at a time with the same sealing material. Next, an interposer 3 is cut to form a plurality of semiconductor devices. <P>COPYRIGHT: (C)2003,JPO</p> |
| 申请公布号 |
JP2003197680(A) |
申请公布日期 |
2003.07.11 |
| 申请号 |
JP20010392698 |
申请日期 |
2001.12.25 |
| 申请人 |
MATSUSHITA ELECTRIC WORKS LTD |
发明人 |
KITAMURA KENJI;FUKUI TARO;HINO HIROHISA;TSUJI TAKAYUKI |
| 分类号 |
H01L23/29;H01L21/56;H01L21/60;H01L23/12;H01L23/31;(IPC1-7):H01L21/60 |
主分类号 |
H01L23/29 |
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