| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To solve the difficulty of a prior art that, when a conventional integrated circuit device is mounted, a load upon bonding is concentrated only on one side of the integrated circuit device, and a bonding means acts on a certain fixed portion, to prevent a bad influence from exerting on the characteristics of the integrated circuit device itself and an electronic part using the integrated circuit device, and to prevent to cause the lowering of yield. <P>SOLUTION: The number of dispositions of external connection pads formed on an integrated circuit device is made equal at each side edge, and external connection pads disposed at each side edge are disposed on linear symmetrical positions with respect to a central line of the integrated circuit device located in parallel to the side edge where the external connection pads are disposed. It is hereby possible to eliminate a bad influence on various characteristics of the integrated circuit device due to bad mounting. <P>COPYRIGHT: (C)2003,JPO</p> |
