| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus and method by which the correcting work of the surface state of a bonding tool can properly and efficiently be performed. SOLUTION: In the ultrasonic bonding apparatus which pressurizes and bonds the electronic component 3 to a board 2 by the bonding operating surface 6b of the bonding tool 6, an ultrasonic vibrator 7 is driven in the state of pressurizing the surface 6b to the measuring surface of a surface state measuring part 1b, and impedance showing the driving state at this time is measured by a measuring part 16. A control part 12 compares this measuring result with determination data stored by a storage part 13 to determine whether the surface state of the surface 6b is good or not. When determining it to be bad, the surface 6b is pressurized to a polishing part 1c to be polished for correcting the surface state. Thus, the surface state can be corrected and confirmed without removing the bonding tool 6, and the surface state of the bonding operating surface can properly and efficiently be corrected. COPYRIGHT: (C)2003,JPO |
