发明名称 WIRING MATERIAL AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a thin and light-weight wiring material having good workability at a hole perforating time by preventing working efficiency from decreasing due to the reduction of the thickness of an insulating sheet, and to provide a method for manufacturing the same. SOLUTION: The method for manufacturing the wiring material comprises the steps of sequentially disposing a copper foil 2, a glass paper 1, and a copper foil 3. The paper 1 is obtained by impregnating a glass nonwoven fabric with an epoxy resin. The resin is formed in a sponge shape and has fine air bubbles all therein. The thickness of the paper 1 is 150μm or more. The paper 1 or the like disposed in this manner is vacuum pressed. The vent holes in the paper 1 are blocked by this pressing. The thickness of the paper 1 is compressed to 100μm or less. Since the paper 1 is the nonwoven fiber, the entirety becomes an insulator having substantially uniform permittivity. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003198095(A) 申请公布日期 2003.07.11
申请号 JP20010395255 申请日期 2001.12.26
申请人 IBIDEN CO LTD 发明人 NAGANUMA NOBUYUKI;KOSAKA KATSUMI
分类号 B32B7/02;H05K3/00;(IPC1-7):H05K3/00 主分类号 B32B7/02
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