| 摘要 |
PROBLEM TO BE SOLVED: To improve vibration resistance ability of the dummy terminal of a chip electronic component, constituted by housing an electronic component having lead terminals oriented in the same direction as in a square cylindrical encapsulating case, and providing the dummy terminal on the mounted surface of the encapsulating case for improving the soldering strength. SOLUTION: The dummy terminal 20 is composed of an L-shaped body having a first substrate section 21, which is brought into contact with the mounted surface of the encapsulating case and a second substrate section 22 which is brought into contact with the side face of the case which is continuously formed from the mounted surface, anchor plates 211 which are provided on both side edges of the first substrate section 21, have the same width as that of the section 21, and embedded in the encapsulating case, in a state where the plates 211 are bent from the section 21 at right angles. The anchor plates 211 respectively have openings 212, in which a resin material is filled at formation of the encapsulating case. COPYRIGHT: (C)2003,JPO
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