| 摘要 |
PROBLEM TO BE SOLVED: To prevent the reduction of the bonding area of a resin case and a metallic cap accompanied by the miniaturization of an electronic component, to prevent the varying of electric characteristic and the deterioration of reliability performance caused by the deterioration of bonding strength, and to prevent the variance of the sizes of components in the case of bonding. SOLUTION: A protrusion is formed on the upper surface of the resin case, and a through hole is bored in the metallic cap, which is arranged and bonded to the upper surface of the resin case so as to insert the protrusion into the through hole. In addition, the protrusion projects from the through hole. Furthermore, in the upper surface of the resin case, a groove is formed from the protrusion to the opening part of the resin case. COPYRIGHT: (C)2003,JPO
|
