METHOD OF MOUNTING SEMICONDUCTOR ELEMENT

摘要

PROBLEM TO BE SOLVED: To provide a method of mounting a semiconductor element which can prevent the contact of a compression-bonding head with the mounted semi conductor element. SOLUTION: In the method of mounting a semiconductor element for mounting a plurality of semiconductor elements SD, GD to a semiconductor mounting substrate L1 by thermocompression-bonding by the compression-bonding head S2 which can move upward and downward, the plurality of semiconductor elements SD, GD of different heights can be thermocompression-bonded by thermocompression-bonding by the compression-bonding head S2 sequentially from the lower semiconductor element to the higher semiconductor element. COPYRIGHT: (C)2003,JPO