| 摘要 |
PROBLEM TO BE SOLVED: To provide a supporting base (12) which can very easily transfer a semiconductor wafer even when a thin plate work such as the semiconductor wafer (2) is ground to become extremely thin. SOLUTION: A magnetic tape or a magnetized tape is used as a tape (10) to be adhered to the single surface of a thin plate work or to the surface of the semiconductor wafer (2). The supporting base (12) is formed at least partly with a porous material and also includes an at least partly magnetized or magnetic supporting region (14). COPYRIGHT: (C)2003,JPO
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