摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor element mounting device capable of forming a closed space in a mounting device main body including a workpiece transfer passage, preventing the oxidation of the workpiece at a location specified for vacuum suction, and preventing the oxidation of the semiconductor element with this oxidation preventive process concurrently cooling the semiconductor element immediately after mounting. SOLUTION: A pipe 10 for preventing the overrun of a workpiece 3 vacuum- suctioned at a specified location for transfer in a closed space 4 is connected via a selector valve 43 to a vacuum suction pipe 41, or to a gas supply pipe 42 supplying oxidation preventive gas into the closed space 4 for oxidation prevention or reduction. The pipe 10 is ordinarily connected to the vacuum- suction pipe 41 via the selector valve 43 for suctioning the workpiece 3. In the absence of a workpiece 3 at a mounting station III specified as the location for determining the presence/absence of a workpiece 3, the selector valve 43 is switched to supply the gas to the mounting station III from an oxidation preventive gas source (not shown in Fig.) via the gas supply pipe 42. COPYRIGHT: (C)2003,JPO
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