| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a composite for a ceramic substrate which can be baked at the same time with a conductor metal such as Ag-based, Cu-based, Au-based metals or the like at a relatively low temperature of around 900 to 1,100°C, and has a low porosity and a high strength, and also to provide a method of manufacturing the same. <P>SOLUTION: A ceramic composition is formed of not less than 80 wt.% filler as a main ingredient which can be shrunk until the porosity becomes 10% or below in a baking process, and not more than 20 wt.% glass, or is formed of 80 wt.% filler and more than 20 wt.% glass. To the ceramic composition, 2 to 15 wt.% of glass which is softened after the main ceramic composition shrinks as far as 80% of the final shrinkage amount individually is added. <P>COPYRIGHT: (C)2003,JPO |
