| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To protect the surface of an electrode pad against deterioration and contamination by preventing the intrusion of grinding chips or grinding water at the time of grinding/polishing the rear surface of a semiconductor wafer. <P>SOLUTION: In the device for pasting a substrate surface protective sheet, a heat generating coil 10 is buried in a heater block 9 made of a substance exhibiting high thermal conductivity at a pasting/cutting part 5 and the coil is fixed with power supply terminals 11. Furthermore, a cutter 12 for cutting the surface protective sheet is secured to the heater block 9. The surface protective sheet 13 is hot-pressed by the outer circumferential part of a wafer 14 at the pasting/cutting part 5 and cut off simultaneously at the fringe thereof. The heater block 9 is composed of copper or stainless steel. <P>COPYRIGHT: (C)2003,JPO</p> |
