| 摘要 |
PROBLEM TO BE SOLVED: To surly remove a build-up layer from a flex-rigid printed wiring board without damaging the board. SOLUTION: Glass epoxy substrates 24 and conductors are formed on a flex-rigid printed wiring board 20 so that cable connection parts 26 of the flex- rigid printed wiring board 20 are exposed, and build-up layers 27 are stacked on the whole flex-rigid printed wiring board 20. Next, laser trimming is performed with a laser beam radiated along the periphery of the cable connection 26 on the flex-rigid printed wiring board 20, and the build-up layer 27 surrounded by radiated region by the laser beam is peeled/removed from the flex-rigid printed wiring board 20. COPYRIGHT: (C)2003,JPO |
