| 摘要 |
PROBLEM TO BE SOLVED: To eliminate the problem that, when bonding signal terminals to a metal circuit board, fine cracks are locally generated in a ceramic board, which decreases the mechanical strength of the ceramic circuit board. SOLUTION: The ceramic circuit board is such that the metal circuit board 2 is bonded to the top face of the ceramic board 1, and the signal terminals 3 are directly bonded to the surface of the metal circuit board 2 by an ultrasonic bonding method. In the ceramic circuit board, parts of the metal circuit board 2 to which the signal terminals 3 are bonded are formed 0.2 to 1 mm thick and are thicker than the other parts, and a part of each signal terminal 3 bonded to the metal circuit board 2 is formed 0.3 to 2 mm thick. Due to this structure, high pressure and heat at the time of bonding the signal terminals 3 by an ultrasonic bonding method are sufficiently absorbed and dispersed, thereby preventing cracks from being generated on the ceramic board 1. COPYRIGHT: (C)2003,JPO
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