| 摘要 |
In a process of producing an image pickup device, a solid-state image pickup element is joined to a transparent substrate, with its light-receiving surface opposed to the transparent substrate, and sealed with a thermosetting resin. A peripheral IC chip is bonded to a surface of the image pickup element opposite from the light-receiving surface. The image pickup element and peripheral IC chip are inserted into a through hole of a printed circuit board, and the transparent substrate is connected to the printed circuit board, which is then connected to the peripheral IC chip through wires. The wires, the image pickup element and the peripheral IC chip are sealed with a coat resin. A lens holder is fitted to the printed circuit board and a surface of the transparent substrate opposed from the surface joined with the image pickup element, using side surfaces of the transparent substrate as reference planes.
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