A system and method for using a thin polymer film member 34 to bond indicia 36 in the molding process for manufacturing wafer containers 10 and other plastic articles for use in the semi-conductor manufacturing industry, and particularly such articles for use in semiconductor fabrication clean room environments. The system and method enables multicolored indicia and unique electronically readable indicia to be blonded to the article, while also providing a protective containment barrier to inhibit process contamination stemming from the indicia and to protect the indicia from physical damage.
