Metal wiring board, semiconductor device, and method for manufacturing the same

摘要

The present invention provides a metal wiring board in which metal wiring buried in a surface layer of an electrically insulating substrate is adhered to a carrier sheet covering the metal wiring that can be mechanically detached and that can prevent oxidation of the metal wiring. A semiconductor device that uses this substrate is structured so that a metal terminal electrode buried in an electrically insulating substrate is electrically connected to a protruding electrode on a semiconductor element, the protruding electrode has a structure wherein its tip is flattened by mounting the semiconductor element to the substrate, and the portion where the substrate and the semiconductor element are connected is reinforced by an insulating resin structure and formed into a single unit therewith. Thus, the present invention provides a metal wiring board that uses low-cost wiring patterns, is low resistance, and is provided with a carrier sheet with which highly reliable bump connection is possible, a semiconductor device, and a method of manufacturing the same.