| 摘要 |
The invention relates to a method of soldering the constituent layers of a multilayer printed circuit and the machine used for same. The inventive method can be used for circuits of the type consisting of layers having a circuit image (2, 3, 4, 5) which are provided with peripheral strips (9) comprising reserve areas (11), said circuit image layers being stacked and separated from one another by isolating layers (6, 7, 8). Said method comprises the following steps: i) providing a heating circuit (13) in each reserve area (11), said heating circuit consisting of at least one short circuited turn (14); ii) stacking the circuit image layers (2, 3, 4, 5) and the isolating layers (6, 7, 8) in an alternating manner; iii) fixing the position of the layers (2, 3, 4, 5, 6, 7, 8) in relation to one another, the reserve areas (11) forming groups (12) of reserve areas; iv) providing induction electrodes (18) which rest on the groups (12) of reserve areas; and v) soldering each of said groups (12) by applying a variable-induction magnetic field.
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