发明名称 THERMAL COMPENSATION AND ALIGNMENT FOR OPTICAL DEVICES
摘要 <p>An arrayed waveguide device has an expansion rod for adjusting a position of the optical paths at a star coupler, by thermal expansion, to compensate for wavelength response dependence on temperature. A bearing surface parallel to a plane of the waveguides prevents movement out of the plane and allow movement along the bearing surface parallel to the plane. Thus small lateral movements can occur accurately without introducing losses through unwanted vertical movements using a passive mechanical arrangement. It can be used together with active thermal control, to give better compensating accuracy, or compensation for manufacturing variations. An optical component assembly has a substrate having one or more mating profiles, and first and second planar waveguide chips having mating profiles. During assembly, the mating profiles enable passive alignment of an optical coupling between respective waveguides of the chips. A groove locates a fiber on the chip using passive alignment.</p>
申请公布号 WO2003056373(A2) 申请公布日期 2003.07.10
申请号 GB2002005791 申请日期 2002.12.19
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