发明名称 PROCESSES OF FORMING THERMAL TRANSFER MATERIALS, AND THERMAL TRANSFER MATERIALS
摘要 The invention encompasses a process of forming a thermal transfer material having low volatility. A substrate is provided, and a gelatinous mass is formed on a surface of the substrate. While the gelatinous mass is on the substrate, thermally conductive fibers are inserted into the mass. Subsequently, the gelatinous mass is removed from the substrate. The invention also encompasses a process of forming a thermal transfer material wherein a thermally conductive substrate is provided and a mass is adhered to a surface of the substrate. While the mass is on the substrate, thermally conductive fibers are inserted into the mass. The thermally conductive fibers extend to the surface of the substrate, but do not extend through the substrate. The substrate, mass and fibers together define at least a portion of a thermal transfer material. Additionally, the invention encompasses thermal transfer materials and methods of using thermal materials.
申请公布号 WO02067315(A3) 申请公布日期 2003.07.10
申请号 WO2002US04483 申请日期 2002.02.14
申请人 HONEYWELL INTERNATIONAL INC.;DEAN, NANCY, F.;GUPTA, ANURAG 发明人 DEAN, NANCY, F.;GUPTA, ANURAG
分类号 H01L23/373 主分类号 H01L23/373
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