发明名称 SUBSTRATE TREATMENT METHOD AND SUBSTRATE TREATMENT APPARATUS
摘要 <p>Step 11 extracts parameters such as temperature, pressure, and humidity in an apparatus or a convey time in the apparatus as environment conditions around the substrate affecting formation of a resist pattern and collects only normal data values used when forming a desired resist pattern. Step 12 calculates at least two main components by applying the main component analysis technique to the normal data values, so that step 13 can create a normal region. By using this normal region created as an index when forming a resist pattern on a substrate as an actual product, it is possible to easily determine whether the resist pattern is normal.</p>
申请公布号 WO2003056610(P1) 申请公布日期 2003.07.10
申请号 JP2002013320 申请日期 2002.12.19
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