| 摘要 |
PURPOSE: A method for manufacturing a stack chip package is provided to be capable of stacking semiconductor chips having same size by face up and down method. CONSTITUTION: The first substrate(12) having the first center window(13) is attached to the first semiconductor chip(10) having the first bonding pads. The first semiconductor chip(10) is connected to the first substrate(12) by using the first bonding wire(14). The second substrate(22) having the second center window(23) is attached to the second semiconductor chip(20) having the second bonding pads. The second semiconductor chip is connected to the second substrate by using the second bonding wire(24). The first substrate(12) is connected to the second substrate(22) by using the third bonding wire(30). A molding body is covered on the resultant structure. Conductive balls(34) are attached to the first substrate. |
