发明名称 |
Verbindungswerkstoff für elektronische Bauteile, elektronische Bauteile und Verfahren zu deren Herstellung |
摘要 |
A joining material for an electronic component was disclosed. The component has a plurality of functional layers, each selected from a magnetic layer and dielectric layer and joined with each other. The joining material comprising a glass and a composition of a mol% of ZnO, b mol% of BaO and c mol% of TiO2 (a=12-45, b=4-45, c=18-81, a+b+c=100), wherein 0.1 to 10 weight parts of the glass is added to 100 weight parts of the composition. <IMAGE> |
申请公布号 |
DE69908445(D1) |
申请公布日期 |
2003.07.10 |
申请号 |
DE1999608445 |
申请日期 |
1999.02.25 |
申请人 |
NGK INSULATORS, LTD. |
发明人 |
OOBUCHI, TAKESHI;KODA, YASUNORI |
分类号 |
C03C8/04;C03C8/14;C03C8/24;C04B37/00;C09J1/00;H01G4/30;H01G4/40;(IPC1-7):C03C8/24 |
主分类号 |
C03C8/04 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|