发明名称 |
Method for deconstructing an integrated ciruit package using lapping |
摘要 |
A method is provided for deconstructing an integrated circuit package comprising: taking an integrated circuit package comprising a lead frame having a plurality of wire bond pads for placing a die into electrical contact with the lead frame, and an encapsulant encapsulating the wire bond pads; and removing the encapsulant to expose the wire bond pads; wherein at least a portion of the encapsulant is removed by a lapping process.
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申请公布号 |
US2003126741(A1) |
申请公布日期 |
2003.07.10 |
申请号 |
US20020041717 |
申请日期 |
2002.01.07 |
申请人 |
DLUGOKECKI JOSEPH J.;NAZARENO GERARDO BAGALAWIG;ROBBINS CARMENCITA I.;SWENDROWSKI STEVEN DAVID |
发明人 |
DLUGOKECKI JOSEPH J.;NAZARENO GERARDO BAGALAWIG;ROBBINS CARMENCITA I.;SWENDROWSKI STEVEN DAVID |
分类号 |
H01L21/56;(IPC1-7):H01R43/00;H05K3/30;B24B7/19 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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