发明名称 Method of manufacturing optical waveguide and method of manufacturing OPTO-electric wiring board
摘要 After an optical waveguide substrate including a supporting substrate is adhered to an electric wiring board, the supporting substrate alone is dissolved using an organic solvent for removal. Alternatively, the supporting substrate alone is melted through a thermal treatment for removal. Further, a core layer of an optical waveguide is formed on the substrate using a photosensitive resin having a thermal expansion coefficient substantially identical to that of the supporting substrate.
申请公布号 US2003128907(A1) 申请公布日期 2003.07.10
申请号 US20020303976 申请日期 2002.11.26
申请人 NEC TOPPAN CIRCUIT SOLUTION, INC. 发明人 KIKUCHI HIDEO;ODA MIKIO;KOUTA HIKARU;KITAJO SAKAE;SHIMADA YUZO
分类号 G02B6/13;G02B6/12;G02B6/42;G02B6/43;H05K1/02;H05K3/00;(IPC1-7):G02B6/12;G02B6/10 主分类号 G02B6/13
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