发明名称 |
Method of manufacturing optical waveguide and method of manufacturing OPTO-electric wiring board |
摘要 |
After an optical waveguide substrate including a supporting substrate is adhered to an electric wiring board, the supporting substrate alone is dissolved using an organic solvent for removal. Alternatively, the supporting substrate alone is melted through a thermal treatment for removal. Further, a core layer of an optical waveguide is formed on the substrate using a photosensitive resin having a thermal expansion coefficient substantially identical to that of the supporting substrate.
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申请公布号 |
US2003128907(A1) |
申请公布日期 |
2003.07.10 |
申请号 |
US20020303976 |
申请日期 |
2002.11.26 |
申请人 |
NEC TOPPAN CIRCUIT SOLUTION, INC. |
发明人 |
KIKUCHI HIDEO;ODA MIKIO;KOUTA HIKARU;KITAJO SAKAE;SHIMADA YUZO |
分类号 |
G02B6/13;G02B6/12;G02B6/42;G02B6/43;H05K1/02;H05K3/00;(IPC1-7):G02B6/12;G02B6/10 |
主分类号 |
G02B6/13 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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