发明名称 Air gaps copper interconnect structure
摘要 An inter-level insulator structure is provided having an effective insulator dielectric constant approaching 1. An embodiment of the inter-level insulator comprises a first metal layer comprising a first plurality of metal lines; a second metal layer comprising a second plurality of metal lines, and at least one via connected to the first metal layer; and an air gap interposed between the first metal layer and the second metal layer. In one embodiment, the air gap is also present between metal lines on either metal layer, such that air gaps act as intra-level as well as inter-level insulators. A method is also provided to deposit and pattern a sacrificial polymer, and form metal layers. The sacrificial polymer is capable of being decomposed to become air gaps during annealing.
申请公布号 US2003127740(A1) 申请公布日期 2003.07.10
申请号 US20030345727 申请日期 2003.01.15
申请人 SHARP LABORATORIES OF AMERICA, INC. 发明人 HSU SHENG TENG;PAN WEI
分类号 H01L21/768;H01L23/522;H01L23/532;(IPC1-7):H01L23/48;H01L23/52;H01L29/40;H01L29/00;H01L21/476 主分类号 H01L21/768
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