发明名称 Gas injection type soldering method and apparatus
摘要 After a reducing gas is mixed with an inert gas by a mixer, a resultant mixed gas is heated by a heater and made to a hot mixed gas which is dehumidified and dried and the temperature of which is increased. The mixed gas is injected to a subject from an injection port formed in a soldering iron, and thereby soldering is performed by heating and melting solder with the soldering iron in the atmosphere of the mixed gas.
申请公布号 US2003127498(A1) 申请公布日期 2003.07.10
申请号 US20020036400 申请日期 2002.01.07
申请人 JAPAN UNIX CO., LTD. 发明人 ABE SHIGERU
分类号 B23K3/02;B23K1/005;B23K1/012;B23K3/03;B23K3/047;B23K3/06;B23K31/02;B23K101/38;B23K101/42;B29C65/12;B29C65/16;B29C65/40;H05K3/34;(IPC1-7):B23K20/14;B23K35/38 主分类号 B23K3/02
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