发明名称 Thermally-stabilized thermal barrier coating and process therefor
摘要 A thermal barrier coating (TBC 26) and method for forming the TBC (26) on a component (10) characterized by a stabilized microstructure that resists grain growth, sintering and pore coarsening or coalescence during high temperature excursions. The TBC (26) contains elemental carbon and/or a carbon-containing gas that increase the amount of porosity (32) initially within the TBC (26) and form additional fine closed porosity (32) within the TBC (26) during subsequent exposures to high temperatures. A first method involves incorporating elemental carbon precipitates by evaporation into the TBC microstructure. A second method is to directly incorporate an insoluble gas, such as a carbon-containing gas, into an as-deposited TBC (26) and then partially sinter the TBC (26) to entrap the gas and produce fine stable porosity within the TBC (26).
申请公布号 US2003129378(A1) 申请公布日期 2003.07.10
申请号 US20020064791 申请日期 2002.08.16
申请人 GENERAL ELECTRIC COMPANY 发明人 MOVCHAN BORIS A.;RUDOY YURIY E.;NERODENKO LEONELLA M.;DAROLIA RAMGOPAL;SPITSBERG IRENE;THOMPSON ANTHONY MARK;JOHNSON CURTIS ALAN;WORTMAN DAVID JOHN
分类号 C23C8/02;C23C14/06;C23C28/00;F01D5/28;(IPC1-7):B32B3/26 主分类号 C23C8/02
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