| 摘要 |
A method of planarizing a circuit surface is disclosed. The basic idea is to use the photoresist mask for etching as the mask for lift-off, i.e. after the substrate patterned with photoresist and dry etched, metal is directly deposited onto it and liftoff afterwards. Thus, the deposited metal is self aligned and filled into the etched pattern with a planar surface. It is important that the metal thickness should be the same as the etching depth. The lithography needs a special recipe and photoresist requires a special pre-treatment so that the metal can form a clean edge without any residual metal along the edge. A prototype using this invention, a MEMS switch, is introduced.
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