| 摘要 |
PURPOSE: A CMP(Chemical Mechanical Polishing) apparatus having a polishing head is provided to be capable of stably fixing a wafer and uniformly supplying pressure at the wafer while carrying out the CMP process by smoothly flowing air by using a vacuum hole. CONSTITUTION: A CMP apparatus is provided with a turn table loaded with polishing pad and a polishing head(200) for conserving and pressing a wafer onto the turn table. The polishing head is provided with a carrier(202), a retainer ring(228) installed at the lower edge portion of the carrier, a supporter(210) installed in the carrier, and a membrane(224) capable of being split from the surface of the supporter. At this time, the supporter includes posts(214) having a vacuum hole(212) for directly adsorbing the wafer. Preferably, the posts are enclosed by each back film(218).
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