A WIREBOND STRUCTURE AND METHOD TO CONNECT TO A MICROELECTRONIC DIE

摘要

A wirebond structure includes a copper pad formed on or in a surface of a microelectronic die. A conductive layer is included in contact with the copper pad and a bond wire is bonded to the conductive layer. The conductive layer is formed of a material to provide a stable contact between the bond wire and the copper pad in at least one of an oxidizing environment and an environment with temperature up to at least about 350°C.