发明名称 |
Wafer splitting method using cleavage |
摘要 |
Notches are formed in a surface of a wafer on which semiconductor elements have been formed. Then, a surface protect tape is stuck to the element formed surface of the wafer. Subsequently, the wafer is cleaved along a crystal orientation using the notches as starting points. Finally, a back surface of the wafer is grounded.
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申请公布号 |
US2003129809(A1) |
申请公布日期 |
2003.07.10 |
申请号 |
US20020306008 |
申请日期 |
2002.11.29 |
申请人 |
TAKYU SHINYA;KUROSAWA TETSUYA |
发明人 |
TAKYU SHINYA;KUROSAWA TETSUYA |
分类号 |
H01L21/304;H01L21/301;H01L21/78;(IPC1-7):H01L21/301 |
主分类号 |
H01L21/304 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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