SEMICONDUCTOR LIGHT EMITTING ELEMENT FORMED ON A CLEAR OR TRANSLUCENT SUBSTRATE

摘要

This invention provides a novel application of a semiconductor light emitting element or light emitting chip preferably disposed on the underside surface of a clear or translucent substrate. In addition connecting wires leading from said element to the perimeter of the substrate connecting to contact pads leading to a circuit board. The conductors are deposited on the substrate using thin film technology. Preferably the light emitting element is packaged in a flip chip having connecting bumps only on one side.