| 摘要 |
PROBLEM TO BE SOLVED: To provide a solution of a polyimide resin composition capable of forming a film at a low temperature and provide a filmy adhesive composed of the solution, bondable at a low temperature in a short time and having excellent adhesive force. SOLUTION: The polyimide resin composition solution contains (A) a polyimide resin solution obtained by polymerizing an aromatic tetracarboxylic acid dianhydride, a diaminopolysiloxane and an aromatic diamine or an aliphatic diamine in a reaction solvent composed of phenyl ether and an azeotropic solvent, (B) an epoxy compound, (C) a silane coupling agent and (D) a cyanate compound. COPYRIGHT: (C)2003,JPO
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