发明名称 Process for the removal of resist material
摘要 The present invention provides a process for the peeling of a resist material with a pressure-sensitive adhesive sheet which involves the improvement in the removal of resist material or the enhancement of peelability of resist material to certainly remove the resist material from the object regardless of the properties or treated state of the resist material. The process comprises applying a pressure-sensitive adhesive sheet to the upper surface of a resist material present on an object, and then peeling said pressure-sensitive adhesive sheet together with said resist material to remove said resist material from said object, wherein, prior to the application of said resist material to said object, surface treatment to said object is effected such that the surface of the object has a surface free energy of to not greater than 60 dyne/cm.
申请公布号 EP1248156(A3) 申请公布日期 2003.07.09
申请号 EP20020008596 申请日期 1999.07.07
申请人 NITTO DENKO CORPORATION 发明人 TOYODA, EIJI;NAMIKAWA, MAKOTO;OKEYUI, TAKUJI
分类号 B08B7/00;G03F7/42;(IPC1-7):G03F7/42 主分类号 B08B7/00
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