| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide the inspection method and the device of pattern matching that can easily, surely, and quickly inspect a wiring defect on a printed circuit board, an LSI, and a wiring pattern. <P>SOLUTION: The disconnection and the short on the wiring of the substrate to be inspected are judged, and the latent disconnection and the short on the wiring are judged by operation for comparing the standard virtual continuity data of the circuit image of an original image film used for image exposure to a photoresist surface for producing a printed circuit substrate, with the image data of the substrate wiring to be inspected of a printed substrate to be inspected. The standard virtual continuity data of the circuit image of the original image film is obtained by the synthesized operation of thinning, expanding, dividing, detecting a reference point, and imaging after reading the image information of the original image film and binarizing it. The pattern data of the substrate to be inspected is obtained by reading the wiring pattern of the printed substrate to be inspected to binarize it and operating to fractionate the three-color components of an RGB from a background part. <P>COPYRIGHT: (C)2003,JPO |
