| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition free from a bromine-containing organic compound and an antimony compound, having excellent adhesion to a substrate, flame retardancy and resistance to solder stress. SOLUTION: This epoxy resin composition for sealing a semiconductor comprises (A) an epoxy resin represented by general formula (1), (B) a phenol resin represented by general formula (2), (C) an inorganic filler, (D) a curing accelerator and (E) an N-cyclohexyl-2-benzothiazolylsulfamide as essential components, and the content of the whole inorganic materials in the whole epoxy resin composition is 84-94 wt.%. COPYRIGHT: (C)2003,JPO
|
