RESIN COMPOSITION FOR HOLE-MAKING OF PRINTED CIRCUIT BOARD, SHEET PREPARED FROM THE SAME AND HOLE-MAKING METHOD OF PRINTED CIRCUIT BOARD USING THE SHEET

摘要

PROBLEM TO BE SOLVED: To provide a resin composition for hole-making of a printed circuit board, which gives excellent and precise positioning of a hole and locationing of plating at the time of hole-making of a printed circuit board and has fine storage stability, also to provide a sheet prepared from the same composition for hole-making and a method of hole-making using the sheet provided. SOLUTION: The resin composition comprises (A) 40-99 wt.% of a water-soluble polymer and (B) 1-60 wt.% of a random copolymer of a polyalkylene glycol consisting of repetitions of an ethylene oxide component of the formula, -[CH2CH2O]-, and a≥3C alkylene oxide component of formula (1) where the amount of the ethylene oxide component is 50-90 wt.% of the total amount and the viscosity at 20°C is 200-60,000 mPas. Additionally, the composition includes the polymer of a compound of formula (2) when it is required (wherein R1is a hydrogen atom or a methyl group and n is an integer of 10-22). COPYRIGHT: (C)2003,JPO