HEAT-RESISTANT RESIN COMPOSITION AND COATING MATERIAL

摘要

PROBLEM TO BE SOLVED: To provide a coating material containing a coating film component composed of a polyamideimide resin-based heat-resistant resin composition having high heat-resistance and adhesivity after the hot-curing at≥350°C and excellent formability. SOLUTION: The heat-resistant resin composition contains (A) a polyamideimide resin obtained by reacting a diisocyanate compound or a diamine compound with a tribasic acid anhydride or a tribasic acid anhydride chloride in a basic polar solvent and (B) a metal salt and/or (C) an antioxidant as essential components. The coating material contains the heat-resistant resin composition as a coating film component. COPYRIGHT: (C)2003,JPO